Different Volumetric Ratios for Preparing Ternary Cu2SnS3 Thin Films using Fully Controlled System of Spray Pyrolysis

Abstract

Ternary thin films have been clearly deposit using fully computerized system of spray pyrolysis technique onto glass substrates maintained at 310±5 °C. A mixture of an aqueous solution of thiourea, tin chloride dehydrate and copper chloride was used as spraying liquid. The optimumvolumetric ratio of mixing was found to be [S/(Cu+Sn)=1] at pH =1.5, in the present work. XRD examination was revealed CTS in a monoclinic phase. Number platform speeds were employed in the spraying process. XRD peaks were described at 2? = 28.39°, 33.02°, 47.34°, and 56.39° corresponding to , , , and , respectively. The FTIR investigations were certified a numeral of the chemical bond of Cu-, Sn- and S-. The grain size was observed in the range of nanosized using Scherrer formula. Studying surface morphology of CTS films reveals a uniform coating on the substrates which approved by SEM investigations.